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790+® RIE Reliable Etch Solutions for R&D and Production |
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790+® RIE
Plasma-Therm’s 790+® RIE provides reliable capability for etch applications in a variety of markets. The well-established 790™ format of parallel-plate RIE is augmented by an extended electrode size in the 790+®.
Hardware
- Manual Handling — single or multi-substrate
- Variety of loading configuration — up to 16 inch diameter substrates
- Substrate electrode bias at 13.56 MHz
- MFCs with filtered and bypassed gas lines
- Temperature-controlled electrode
- Mag-Lev turbo pump
Endpoint
Integrated multifunctional endpoint capability
Software
- User-friendly Windows based software
- Real-time process data display
- Data logging
- Edit recipes during runs
- Fully integrated endpoint system
- Multiple user access levels
- Alarm history
Process
- Extensive process library
- Industry-leading uniformity and etch rate
790+® vs. 790™
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790+® |
790™ |
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Electrode size |
16" |
11" |
| Integrated OES with EndpointWorks |
Yes |
No |
| Available RF Bias Power |
1000 W |
600 W |
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MagLev turbo |
Yes |
No |
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Distributed pumping baffles |
Yes |
No |
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Direct RF power deliver |
Yes |
No |
For more information, contact us at information@plasmatherm.com or at +1.727.577.4999 |
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