Mask Etcher® Series
Plasma-Therm has pioneered dry etching for the highly specialized photomask market for more than 15 years.
Mask Etcher® systems set dry etch performance and flexibility standards for photomask production. Plasma-Therm’s Mask Etcher® solution is a key enabler of Moore’s law and shrinking technology nodes.
A wide variety of films can be etched from entry level 250um technology to < 32nm production with ICP high density plasma etch systems.
Excellent uniformity and particle control are achieved through innovative technologies while maintaining high system production uptime. Plasma-Therm’s latest Generation V Mask Etcher® excels in CD uniformity and linearity well below 5 nm.
Mask Etcher® 2-V Evolution