VERSALINE HDPCVD
Plasma-Therm’s VERSALINE HDPCVD product is a new approach to achieving highly dense and conformal films at low deposition substrate temperatures.
The system utilizes a high-density ICP plasma with a temperature-controlled and biased substrate. Uniform gas injection at the substrate level maximizes film quality.
Hardware
In addition to all of the features and benefits available with the VERSALINE ICP, the VERSALINE HDPCVD offers:
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Flexible & upgradeable handling with 3 inch to 8 inch loading configurations
- LL — single substrate
- CX — cassette-to-cassette loading of wafers
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Substrate temperature control via mechanical clamp
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Substrate bias at 13.56 MHz
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Low particulate processing environment with thermally managed reactor design — up to 180°C for walls and showerhead
Endpoint
Integrated multifunctional endpoint capability with EndpointWorks
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Laser Interferometry
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OEI
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OES
Software
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User-friendly SEMI standard interface (E-95)
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Comprehensive data logging
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Automated cleaning program (AMS)
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Real-time process data display
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Fully integrated endpoint system
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Factory automation compatible (SECS/GEM)
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Edit recipes during runs
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Multiple user access levels
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Alarm history
Process
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Low Temperature
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Trench Fill
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High-Density films
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High Uniformity
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Tunable Index
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Doping
For more information, contact us at information@plasmatherm.com or at +1.727.577.4999 |
