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Plasma Dicing
On-tape plasma-based die singulation is a novel approach to die
separation. It allows complete dicing of any thickness wafers, especially thin and ultra-thin,
on industry-standard tape frames after grinding.
The key to plasma dicing is the process
selectivity, and handling and maintaining complete integrity of metal or plastic tape
frames in a vacuum plasma-based reactor.
Frame and wafer size compatibility
- Singulator® platform accepts-industry standard dicing tapes and choice of conventional
plastic or metal tape frames.
- Use of 8-inch frame accommodates wafers and pieces up to 8-inch diameter,
allowing for continuous operation with no need for automation recalibration.
Simple process-flow integration
- Plasma dicing is done from the front side of wafers after backside grinding
in case of thin and ultra thin wafers, maintaining the simple process flow used
with saw dicing.
- Tape and frame integrity after plasma dicing allows for direct use of grip ring
for tape expansion and pick-and-place operation with no additional steps.
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