Pictures courtesy of Sandia National Laboratories, SUMMiTTM Technologies

Deep Silicon Etch™ used in MEMS/NEMS applications

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The MEMS and NEMS technology areas consist of Micro Electro Mechanical Systems and smaller Nano Electro Mechanical Systems. MEMS and NEMS devices are rapidly expanding into new applications that include customer and industrial products that range from sensors to actuators to passive devices.

MEMS/NEMS devices are used in:

  • Electronics
  • Fluidics
  • Mechanics
  • Magnetics
  • Acoustics
  • Optics

Inkjets, gyroscopes, accelerometers and oscillators are just a few of the devices that have been commercialized.

The diversity of MEMS and NEMS devices requires a fundamental understanding of the processes used to fabricate them.

Enabling technologies

Plasma-Therm has developed the following technologies to address the complex processes associated with silicon and deep oxide etching.

  • Profile control with parameter morphing (patented)
  • Smooth side wall with short process step times
  • Fast Gas Switching (patented)
  • Fast and stable pressure control (patented)
  • Solid State RF Tuning
  • Notchless silicon-on-insulator etching (patent pending)
  • Innovative RF bias waveform
  • Patented Endpoint algorithm techniques
  • Aspect Ratio Dependent Etching reduction (patent pending)
  • Process Stability (Temperature Stabilized ICP)

The application of these technologies has resulted in unmatched process flexibility and latitude. Additionally, these technologies result in industry leading selectivities to mask material.

Plasma-Therm continues to develop specific solutions for the MEMS/NEMS industry.



Detail Images


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