Heatpulse™ RTP System
OUR HEATPULSE RTP IS A NEWLY RELEASED RAPID THERMAL PROCESSING (RTP) SYSTEM CAPABLE OF PROCESSING DIVERSE MATERIALS IN A VARIETY OF SUBSTRATE SIZES
Rapid thermal processing (RTP) can be used in a multitude of semiconductor process steps, such as post-implant annealing, growth of oxide and nitride films, reflow, and formation of silicides, salicides, and metal alloys. In a single-wafer chamber, wafers are rapidly heated and held at a closed-loop controlled temperature. The Heatpulse RTP system can process a variety of substrates, such as silicon, silicon carbide (SiC), gallium arsenide (GaAs), gallium nitride (GaN), quartz, and sapphire.
AG Heatpulse Legacy Systems
We support the legacy AG Heatpulse 8108 and 8800 systems with spare parts, field service, and upgrades.
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