Plasma-based etch, deposition, plasma dicing, and rapid thermal processing systems designed to exceed your expectations
Our easy-to-use plasma-based systems are among the best you’ll find — and for good reason. It’s in our DNA. Our continuous improvement processes keep us at the top of our game, so you get the best we have to offer in a variety of application-specific solutions. From etch and deposition applications to surface modification, stripping, and dicing, our systems keep pace with your needs and are engineered to provide outstanding performance time after time.
Modular designs for flexible configuration and material handling to meet your varied requirements
Engineered to continually deliver outstanding coverage, highly uniform film deposition, and material control
Designed to ensure damage-free material removal or create robust coatings that improve substrate surfaces
Yield enhancing plasma singulation systems that address pain points of traditional saw dicing
Let our experts help you customize our processes solutions for your applications.