PLASMA TECHNOLOGY DESIGNED FOR MAXIMUM PERFORMANCE
Premium plasma etch, deposition, and advanced packaging equipment for creating semiconductor devices that responsibly enhance the lives of people around the world.
A redesigned single-wafer RTP platform with upgraded robotics and best-in-class process control software, Cortex®
We continually improve our process system technology to deliver the best performance possible.
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Our systems support etch, deposition, thermal, material modification and die singulation applications for existing and emerging microelectronics markets.
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Latest Blogs and News
A New Production Solution for High Selective and Low-Damage Etching of GaAs-Based Devices
Conventional reactive ion etching (RIE) has generally been used for selective etching of GaAs over AlGaAs. However, there is a great demand for an advanced process with improved uniformity and etch rate, and with a minimal damage for GaAs-based devices. With large scale wafers (150 mm GaAs), the uniformity control is becoming more critical. There […]
The Effects of Increasing the Aspect Ratio of GaAs Backside Vias
To support the current trend in industry of working towards higher via densities which could shrink via dimensions, we report new process development work to accommodate these smaller via geometries.
Assessing Deep Reactive Ion Etch (DRIE) at CNF
Cornell University’s Nanoscale Science and Technology Facility (CNF) recently took delivery of a VERSALINE® deep silicon dry etching system. The comprehensive assessment process described here took a year to complete.
We look forward to meeting you at CS Mantech 2023, an international compound semiconductor manufacturing technology conference.
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