Some like it hot, some like it not. With Plasma-Therm®, you can have it both ways.
Our HDRF low temperature technology is proven for demanding applications. Remove photoresist and polymer residue without damaging your sensitive devices and complex structures – for optimal quality of Bosch-process devices.
HDRF technology incorporates a proprietary, distributed inductively coupled plasma (ICP) source
The unique source design produces 50 to 100 times more radicals than other technologies and delivers damage-free process results
Before and After
The HDRF application portfolio includes scallop smoothing after DRIE, and surface activation before wafer bonding
Our high temperature stripping can also support descum and polyimide processes, as well as BCB, SU8 and PBO ashing
OUR HDRF PRODUCTS
Let our experts help you customize our processes solutions for your applications.