To meet carbon neutrality goals, the world is relying on power transformation strategies to reduce greenhouse emissions. The critical role of power devices will drive high market growth in this area. For every application that uses electricity, from consumer appliances and electric vehicles to data centers and energy generation, efficiency will be a key requirement. Power devices will be fundamental to meeting that requirement.
In addition to traditional silicon-based power devices, those fabricated from compound semiconductor materials like gallium nitride (GaN) and silicon carbide (SiC) are contributing to a cleaner environment. At Plasma-Therm®, we support both silicon- and compound semiconductor–based power device manufacturing with our etch, deposition, ion beam, and plasma dicing process technologies.
Our solutions range from sensitive gate recess etches to high-rate backside SiC via etch, as well as all the associated processes.
Our flexible plasma-enhanced chemical vapor deposition (PECVD) process tools can be tuned to deliver the ideal dielectric films. Our physical vapor deposition (PVD) systems deliver a range of metals solutions for backside or frontside requirements.
Our industry-standard thermal processing technology works on substrates up to 200mm in diameter for fast wafer size changes to accommodate the rapidly changing power device substrate market.
Plasma-etch dicing with the Singulator® system is ideal for power devices to enhance sidewalls, improve die strength, enable street sizes <10µm, and create any shape die you want.
Power Device Applications
The efficiency of wideband power devices provides power supplies for consumer electronics that deliver savings in weight and size as well as power. Power electronics are widely used in renewable energy power generation, electric vehicles, and space applications. They must withstand high voltages and currents to supply controlled power.
Let our experts help you customize our processes solutions for your applications.