The ongoing push for global connectivity that relies on mobility, the Internet of Things (IoT), and 5G calls for robust, leading-edge wireless technology. The devices underpinning wireless technology are built using compound semiconductor materials.
Compound semiconductor devices include heterojunction bipolar transistors (HBT), high-electron-mobility transistors (HEMTs), and surface acoustic wave (SAW) and bulk acoustic wave (BAW) technology used in digital, analog, and mixed integrated circuits for radio, power, and other high-frequency applications.
At Plasma-Therm®, we support compound semiconductor device manufacturing with our etch, deposition, ion beam, and plasma dicing tools.
If you’re looking for reproducibility and a process library for the wide range of materials used in wireless applications, then Plasma-Therm has you covered. VERSALINE® systems provide the range of inductively coupled plasma (ICP) and ion beam etch (IBE) needed for compound semiconductor, metals, dieletrics, and piezoelectric materials used in SAW, BAW, and film bulk acoustic resonator (FBAR) filters.
Just one example of our innovative approaches is our advanced plasma-enhanced chemical vapor deposition (PECVD) helium dilution technology, which provides a stress-free silicon nitride deposition process to prevent device damage.
Our industry-standard thermal processing technology works on substrates up to 200mm in diameter. Fast wafer size changes accommodate the range of substrates being used.
Our Singulator® system is ideal for damage-sensitive compound semiconductors like gallium arsenide (GaAs) and indium gallium arsenide (InGaAs). You get smooth sidewalls, improved die strength, street sizes <10µm, and any shape die you want.
Wireless & Connectivity Applications
Let our experts help you customize our processes solutions for your applications.