Wireless Connectivity

From specific profiles to the smallest geometries, you’ll experience repeatability, reliability, and lower cost of ownership in compound semiconductors for wireless connectivity.

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The ongoing push for global connectivity that relies on mobility, the Internet of Things (IoT), and 5G calls for robust, leading-edge wireless technology. The devices underpinning wireless technology are built using compound semiconductor materials.

Compound semiconductor devices include heterojunction bipolar transistors (HBT), high-electron-mobility transistors (HEMTs), and surface acoustic wave (SAW) and bulk acoustic wave (BAW) technology used in digital, analog, and mixed integrated circuits for radio, power, and other high-frequency applications.

At Plasma-Therm®, we support compound semiconductor device manufacturing with our etch, deposition, ion beam, and plasma dicing tools.


If you’re looking for reproducibility and a process library for the wide range of materials used in wireless applications, then Plasma-Therm has you covered. VERSALINE® systems provide the range of inductively coupled plasma (ICP) and ion beam etch (IBE) needed for compound semiconductor, metals, dieletrics, and piezoelectric materials used in SAW, BAW, and film bulk acoustic resonator (FBAR) filters. 


Just one example of our innovative approaches is our advanced plasma-enhanced chemical vapor deposition (PECVD) helium dilution technology, which provides a stress-free silicon nitride deposition process to prevent device damage. 

Thermal Processing

Our industry-standard thermal processing technology works on substrates up to 200mm in diameter. Fast wafer size changes accommodate the range of substrates being used. 

Plasma Dicing

Our Singulator® system is ideal for damage-sensitive compound semiconductors like gallium arsenide (GaAs) and indium gallium arsenide (InGaAs). You get smooth sidewalls, improved die strength, street sizes <10µm, and any shape die you want. 

Wireless & Connectivity Applications

The world is becoming more connected every day. Wireless mobility that relies on 5G and Internet of Things (IoT) devices is pervasive and critical to our goal of enhancing the human experience. In a wireless world, power amplifiers and switches become critical components for communicating between the ever-increasing number of mobile and smart devices.

5G standards require more RF filters in mobile products and network infrastructures than previous generations. They must support higher frequencies and increased bandwidth. Surface acoustic wave (SAW), film bulk acoustic resonator (FBAR), and bulk acoustic wave (BAW) filters are the advanced high-frequency acoustic sensors that are critical to reducing power consumption, improving battery life, and handling the increasing number of RF communication bands.

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Explore All Process Technology

We continuously improve our plasma etch, deposition, and plasma dicing technology to help you build the best products on the market.


Our easy-to-use plasma-based systems keep pace with your needs and are engineered to provide outstanding performance time after time.


Let our experts help you customize our processes solutions for your applications.