Backed by decades of knowledge, along with the understanding of process nuances and subtleties, Plasma-Therm’s® proven deposition systems and solutions help you remove risk, improve efficiency, enhance capacity, and increase yield.
From plasma-enhanced chemical vapor deposition (PECVD) and high-density plasma chemical vapor deposition (HDPCVD) to ion beam deposition (IBD), physical vapor deposition (PVD), and fast atomic sequential technology (F.A.S.T.), we have fine-tuned an assortment of plasma-enhanced deposition systems to help you achieve precisely the film features you need for optimal device performance.
We are continuously innovating our deposition systems and adding new capabilities that deliver added value at a lower cost of ownership. Here are a few we’re particularly proud of.
This is what comes from decades of technological innovation. Our VERSALINE® PECVD can deposit a variety of precision films for maximum productivity at low cost of ownership.
Plasma-Therm® set the bar high to develop a control system with an easy-to-use, feature-rich interface. The Cortex® control system, with our flexible automated clean and prep (ACAP) feature, drives high uptimes and can be implemented across all our technologies.
When you need reproducibility in a production environment, choose a system with EndpointWorks®, our endpoint program that works with laser interferometry, optical emission spectroscopy, and other inputs.
Let our experts help you customize our processes solutions for your applications.