Trying to dice today’s thin and ultra-thin wafers using traditional sawing methods is like trying to perform brain surgery with a hacksaw. Cost-conscious wafer processing requires using as much wafer real estate as possible for dies and driving maximum yields. For advanced node devices, high-density advanced packages, and MEMS and sensors, you need dicing systems that result in improved die strength, no lateral damage, smooth sidewalls, and the ability to navigate rounded corners, create custom die shapes, and achieve street sizes of 10µm or smaller.
We’ve built all of these capabilities into our Singulator® plasma dicing platforms. Explore the solutions for advanced packaging.
Wafer Size Flexibility
Our Singulator MDS-100™ and MDS-300™ models are the industry’s first plasma singulation systems for volume production to address wafers from 100mm to 300mm.
Backend Compatibility
For plasma-dicing success, you need a system with options. The Singulator system is easy to use and is compatible with industry-standard dicing tapes and both plastic and metal frames.
EndpointWorks®
Our integrated endpoint technology, EndpointWorks, compensates for non-uniform substrate thickness. If you’re dicing before grinding, EndpointWorks stops your dicing street at just the right spot.
Control System
With Cortex®, you get automatic data logging and charting combined with an automated maintenance scheduler and SECS/GEM factory system integration to enhance your productivity.
Singulator®
MDS-100
MDS-300
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