At Plasma-Therm®, we want the best for you. Our team understands that your specific needs may vary from the needs of others, even inside your own fab. That’s why we’re always ready to help dial in your tool and process to ensure it meets your requirements. Whether these individual platforms or cluster systems reside in R&D environments or high-volume production manufacturing lines, we take extra care to ensure you have what you need. Some call this service. We call it teamwork.
We are continuously innovating our etch systems and adding new capabilities that deliver added value at a lower cost of ownership. Here are a few we’re particularly proud of.
We add ICP to select reactive ion etch (RIE) systems to give you the right control needed for the application. Whether you need higher rates for productivity or a slow and controllable pace for critical processes, ICP has the capability.
When etch depths for silicon are beyond a few microns and the greatest control is needed for sidewall smoothness, profile, and selectivity, then the deep reactive ion etching (DRIE)-configured VERSALINE® system featuring Plasma-Therm’s DSE™ is your system of choice.
When you need reproducibility in a production environment, choose a system with integrated EndpointWorks, our endpoint program that works with laser interferometry, reflectance, optical emission spectroscopy, and other inputs.
When you need the technology of ion beam-driven processes with high-performance precision directional etching, coupled with long life and low-maintenance ion sources, then our IBE is ready. Whether the technology is on Plasma-Therm’s® QuaZar™ system or mated with our VERSALINE® system, the advanced motion controls, including tilt and rotation, provide the industry-leading solution.
Let our experts help you customize our processes solutions for your applications.