Etch and PECVD technology applications in nanotechnology

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Nanotechnology is the study and use of materials on an atomic or molecular scale. Nanotechnology is typically less than 100 nm in a single dimension and has the potential to create many new materials and devices with applications in medicine, electronics and energy production.

By leveraging the use of photomask, DSE™, and other core technologies, as well as an in-depth understanding of critical dimensions at a nano scale, Plasma-Therm continues to serve the needs of the growing nanotechnology market.

A strong history of collaborations within the nanotechnology sector and an extensive reach within the R&D market positions Plasma-Therm to help customers with their research and development goals.

Typical applications

  • Gratings
  • Channels
  • Arrays (e.g. patterned media)
  • Film stacks
  • High aspect ratio structures
  • Low temperature deposition
  • Wafer dicing (die singulation)

Controllable etching of gratings and arrays is achieved with low power processes for III-V materials.

Nano-imprint structures in quartz materials is done using knowledge from Plasma-Therm’s extensive photomask program.

For deposition on nano structures, Plasma-Therm has low temperature PECVD processes including silicon nitride, silicon oxide, oxy-nitrides and amorphous silicon.

Process matching to various applications is possible due to a variety in selection of Plasma-Therm equipment. For example, Plasma-Therm systems span from atmospheric loading to large format cassette-to-cassette.

Each system provides the latitude to vary process chemistries with minimal system reconditioning.



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