An increase in device performance along with a reduced price is driving semiconductor innovation. Photomask technology is currently at the front end of the International Technology Roadmap for Semiconductors (ITRS).
Plasma-Therm has been a leading supplier of dry etch systems to the global photomask market for more than 15 years. We currently have the largest install base for both R&D through production. Extensive experience in this field has resulted in industry technological innovations.
We provide etch solutions for all major photomask technologies including chrome (Cr) etch for binary masks, molybdenum silicide (MoSi) etch for embedded attenuated phase shift masks (EAPSM) and quartz etch for alternating aperture phase shift masks (AAPSM). Plasma-Therm is focusing on Next Generation Lithography to develop Nano Imprint and EUV solutions for the photomask industry.
Plasma-Therm Mask Etcher® systems serve photomask technology nodes to 32nm and below. Our systems provide high uptime, low defect density, high uniformity, bias and linearity.
NGL : Nano-Imprint and EUV