An increase in device performance along with a reduced price
is driving semiconductor innovation. Photomask technology is currently at the front end
of the International Technology Roadmap for Semiconductors (ITRS).
Plasma-Therm has been a leading supplier of dry etch systems
to the global photomask market for more than 15 years, with the largest
installed base for both R&D and production. Extensive experience in this field
has resulted in industry technological innovations.
Plasma-Therm provides etch solutions for all major photomask technologies,
including chrome (Cr) etch for binary masks, molybdenum silicide (MoSi) etch for embedded
attenuated phase-shift masks (EAPSM), and quartz etch for alternating aperture phase-shift
masks (AAPSM). Plasma-Therm is focusing on next-generation lithography to develop Nano
Imprint and EUV solutions for the photomask industry.
Plasma-Therm's Mask Etcher® systems serve photomask
technology nodes to 32nm and below. These systems provide high uptime, low defect density,
high uniformity, bias and linearity.
- Cr etch
- Molysilicide etch
- Quartz etch
- NGL: Nano-Imprint and EUV
For more information, contact us at
email@example.com or at +1.727.577.4999