Singulator® dices wafers on industry-standard tape frames.

More good die per wafer

More active si per die

Singulator^®
MDS-100, MDS-300

Plasma-Therm's Singulator^® models MDS-100 and MDS-300 are the first volume-production-ready plasma singulation systems.

Singulator^® systems deliver unique benefits compared to traditional dicing techniques, especially for thin and ultra-thin wafers:

• Smooth sidewalls
• No lateral damage
• Improved die strength
• Street size as small as 10μm and less
• Dicing of non-rectangular dies (rounded corners, key shape, etc.)

Tape-frame cassette handling system

• Supports industry-standard dicing tape with plastic or metal frames
• Load two cassettes with up to 25 frames each
• Continuous operation for 4-, 6-, 8-inch wafers on 8-inch tape frames, and 12" wafers on tape frames
• Integrated laminar flow and anti-static bars for operation in backend environment

High-rate process chamber

• Yield-enhancing, proprietary plasma source
• Highest throughput — up to 3,000 mm/sec dicing speed equivalent

Process control

• Integrated endpoint technology with EndpointWorks™ software compensates for non-uniform substrate thickness

On-tape process extendibility

• TSV reveal
• Wafer thinning
• Stress relief

Enhanced productivity with Cortex^® control system

• Automatic data logging and charting
• Automated maintenance scheduler
• Factory system integration (SECS/GEM)