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Plasma singulation enables more dies
and more active silicon.
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Singulator®
MDS-100, MDS-300
Plasma-Therm's Singulator® models MDS-100 and MDS-300 are the first volume-production-ready
plasma singulation systems.
Singulator® systems deliver
unique benefits compared to traditional dicing techniques,
especially for thin and ultra-thin wafers:
- Smooth sidewalls
- No lateral damage
- Improved die strength
- Street size as small as 10μm and less
- Dicing of non-rectangular dies (rounded
corners, key shape, etc.)
Tape-frame cassette handling system
- Supports industry-standard dicing tape with
plastic or metal frames
- Load two cassettes with up to 25 frames
each
- Continuous operation for 4-, 6-, 8-inch
wafers on 8-inch tape frames, and 12" wafers on tape frames
- Integrated laminar flow and anti-static
bars for operation in backend environment
High-rate process chamber
- Yield-enhancing, proprietary plasma source
- Highest throughput — up to 3,000 mm/sec
dicing speed equivalent
Process control
- Integrated endpoint technology with EndpointWorks™
software compensates for non-uniform substrate
thickness
On-tape process extendibility
- TSV reveal
- Wafer thinning
- Stress relief
Enhanced productivity with Cortex® control system
- Automatic data logging and charting
- Automated maintenance scheduler
- Factory system integration (SECS/GEM)
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