Technical Papers

1. Notch Reduction in Silicon on Insulator
2. Characterization of a 10 um_min chlorine-based ICP etch process for GaAs vias
3. The Advantages of Integrated Passives
4. Advances in Deep Silicon Etching
5. Process and Equipment Challenges for MEMS Deep Silicon Etching
6. Recent Advances in GaN Dry Etching Process Capabilities
7. Advances in GaN Dry Etching Process Capabilities
8. Plasma Processing for MMIC Device Manufacture
9. Photomask Cr Process- 65nm Plasma Etch has Arrived
10. Photomask SBU- 65nm Dry Etch has Arrived
11. 905 nm wavelength laser as a new source for in-situ end point detection of dry etching
12. Reduction of Device Damage During Dry Etching of Advanced MMIC Devices Using
13. Improving Etch Rates in Deep Silicon Etching
14. Significant enhancement of selectivity and anisotropy for high rate plasma etching of
15. Advanced Selective Dry Etching of GaAs_AlGaAs in High Density Inductively Coupled Plasmas
16. RECENT DEVELOPMENT OF ADVANCED InP ETCHING
17. EXTREMELY HIGH SELECTIVITY ETCHING OF GaAs_AlGaAs IN INDUCTIVELY COUPLED PLASMAS
18. Challenges and breakthroughs in plasma processing for advanced electronic device
19. A New Production Solution for High Selective and Low-Damage
20. DEVELOPMENT OF LOW TEMPERATURE SILICON NITRIDE AND SILICON DIOXIDE FILMS BY INDUCTIVELY-COUPLED PLASMA CHEMICAL VAPOR DEPOSITION
21. Recent Improvements in Deep Silicon Etching
22. INDUCTIVELY-COUPLED PLASMA DEPOSITION OF LOW TEMPERATURE SILICON DIOXIDE AND SILICON NITRIDE FILMS FOR III-V APPLICATIONS
23. Advanced Processing Capabilities for MEMS Device Fabrication
24. Advanced Thin Film Processing for MMIC Manufacture
25. SELECTIVE RIE IN BCl3_SF6 PLASMAS FOR GaAs HEMT GATE RECESS ETCHING
26. Deep Silicon Etch Profile Control
27. Reliable Deep Silicon Etching for High Volume Production Applications
28. Production Performance Success with a High Throughput PECVD System
29. Characterization of GaAs-AlGaAs non-selective ICP etch process for VCSELs applications
30. Stress Control of Si-based PECVD Dielectrics
31. Quartz etch process to improve etch depth linearity and uniformity using Mask Etcher IV
32. Aspect ratio dependent etching lag reduction in deep silicon etch processes
33. An Integrated Deep Silicon Etch-Directional Physical Vapor Deposition Process for Through Wafer Applications
34. Batch Deposition Module Cuts Downtime and Material Waste
35. Endpoint Detection Methods for Time Division Multiplex Etch Processes
36. Optimization of Low Stress PECVD Silicon Nitride
37. Assessing Deep Reactive Ion Etch (DRIE) at CNF