VERSALINE ICP

Hardware

• Flexible and upgradeable handling
        - LL — single substrate or batch carrier loader
        - CX — cassette-to-cassette loading of wafers or carriers

• Loading configurations for single and multiple wafers

• 2 MHz ICP RF for efficient coupling of power to the plasma

• ICP source with temperature control capable of high power

• Substrate temperature control via mechanical clamp or ESC

• Efficient thermal management with monoblock electrode construction and an active backside helium circuit

• Flexible substrate bias options with 13.56 MHz and 40MHz

• Improved preventative maintenance cycles with thermally managed chamber liner and pump train

• Digital MFCs with filtered and bypassed gas lines

• Available substrate electrode temperature ranges –40ºC to 180ºC

• Chambers with corrosion resistant surfaces

• Mag-Lev turbo pump

• Bulkhead or ballroom installation

Endpoint Options
Integrated multifunctional endpoint capability with EndpointWorks

• Laser Interferometry

• OES

• OEI

• System Parameters

• Custom inputs (e.g., RGA, ellipsometer)
  

Software

• User-friendly SEMI standard interface (E-95)

• Comprehensive data logging

• Automated cleaning program (AMS)

• Real-time process data display

• Fully integrated endpoint system

• Factory automation compatible (SECS/GEM)

• Edit recipes during runs

• Multiple user access levels

• Alarm history

Process

• Optimized etch rates

• High uniformity

• Low particulates

• Tunable selectivity

• Multilayer etch detection

• Profile Control

• Extensive process library
  

For more information, contact us at information@plasmatherm.com or at +1.727.577.4999