VERSALINE PECVD
Plasma-Therm’s VERSALINE PECVD is the result of decades of technological innovation. The VERSALINE PECVD has the ability to deposit many different high-quality films while maximizing productivity and low cost of ownership.
The parallel plate configuration is built to provide a clean processing environment and require little maintenance.
Hardware
-
Simple, low-maintenance chamber with reduced surface area and smooth contours for thorough, high-rate cleaning
-
Highly uniform fractal-based gas distribution
-
13.56 MHz and dual frequencies available
-
Flexible and upgradeable handling
- ML — direct manual loading
- LL — single substrate or carrier loader
- CX — cassette-to-cassette loading of wafers or carriers
-
High temperature electrode up to 350°C
-
Low particulate processing environment with thermally managed reactor design — up to 200°C for walls and showerhead
Endpoint
-
Integrated multifunctional endpoint capability with EndpointWorks
-
Unique OEI application for real-time film thickness and rate monitoring
-
OES for optimized chamber clean
Software
-
User-friendly SEMI standard interface (E-95)
-
Comprehensive data logging
-
Automated cleaning program (AMS)
-
Real-time process data display
-
Fully integrated endpoint system
-
Factory automation compatible (SECS/GEM)
-
Edit recipes during runs
-
Multiple user access levels
-
Alarm history
Process
-
Stress control
-
High uniformity
-
Low damage
-
Low particulates
-
Tunable index
-
Increased productivity with short clean cycles
-
Conformal SiNx films
-
Doping capability (loadlocked versions only)
-
Extensive process library
For more information, contact us at information@plasmatherm.com or at +1.727.577.4999 |
|
