VERSALINE accommodates diverse handling systems and process modules.

 
 


VERSALINE RIE
VERSALINE ICP
VERSALINE DSE
VERSALINE PECVD
VERSALINE HDPCVD

VERSALINE®

Plasma-Therm’s VERSALINE platform is the workhorse for a variety of applications in specialty semiconductor markets. The platform's modular design allows flexible configuration of substrate handling and technologies that address the wide range of customer requirements.

Substrate handling configurations

The VERSALINE platform provides flexibility with a variety of material-handling options. Additionally, the VERSALINE platform gives customers upgrade options that allow the system to evolve from a manual-loading configuration, to a single-substrate or batch carrier vacuum loadlock, to a fully automated cassette-to-cassette handler.

  • ML — manual loading for single substrate or batch
  • LL — loadlock for single substrate or single batch carrier
  • CX — cassette loading

Etch

Deposition

Process control

    EndpointWorks® is available with various endpoint technologies.

Productivity enhancements

  • Data logging
  • AMS (Automated Maintenance Scheduler)
  • SECS/GEM
 
 
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