OUR KOBUS PRODUCT LINE UTILIZING F.A.S.T.® BRIDGES RATE AND CONFORMALITY BETWEEN CVD AND ALD
When thick and conformal films matter, fast atomic sequential technology (F.A.S.T.) is the solution. Based on Plasma-Therm’s® proprietary chemical vapor deposition (CVD) reactor design combined with pulsed capability, F.A.S.T. offers new solutions for 3D integration challenges and other aggressive aspect ratio applications.
F.A.S.T. delivers film conformality superior to plasma-enhanced CVD (PECVD) at deposition rates greater than that of atomic layer deposition (ALD).
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