Our Odyssey HDRF offers efficient, scalable lab-to-fab configurations for resist stripping, polymer removal, sacrificial film etching, and surface modification.
Downstream processing with unique distributed ICP sources avoids ion-related device damage. Available configurations range from a single chamber with manual loading to dual load port/dual process chambers to cluster system arrangements on a VERSALINE® handler. A single-process chamber Odyssey HDRF can be upgraded at any time to a dual-process chamber. Dual-chamber systems can be configured for single-sided processing or sequential dual-sided processing. All Odyssey HDRF systems are built with highly reliable components to achieve system uptime of greater than 92%.
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