VERSALINE RIE
Plasma-Therm’s VERSALINE RIE systems are installed in a wide range of production capacity facilities - from R&D through high-volume production. VERSALINE RIE offers low maintenance and high versatility for multiple applications.
Substrate sizes are conveniently accommodated without ever needing hardware reconfiguration. For future upgradeability to ICP, a high conductance option is available.
Hardware
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Simple, low-maintenance design
- Flexible substrate bias options with 13.56 MHz and 40 MHz
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Flexible and upgradeable handling
- ML — direct manual loading (single or multi-substrate)
- LL — single substrate or multi-substrate carrier loader
- CX — cassette-to-cassette loading of wafers or carriers
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Improved preventative maintenance cycles with thermally managed chamber liner and pump train
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Digital MFCs with filtered and bypassed gas lines
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Mag-Lev turbo pump
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Efficient thermal management with monoblock electrode construction
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Available substrate electrode temperature ranges –40ºC to 180ºC
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Process specific electrode material
Endpoint
Integrated multifunctional endpoint capability with EndpointWorks
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Laser Interferometry
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OEI
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OES
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System Parameters
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Custom inputs (e.g., RGA)
Software
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User-friendly SEMI standard interface (E-95)
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Comprehensive data logging
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Automated cleaning program (AMS)
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Real-time process data display
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Fully integrated endpoint system
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Factory automation compatible (SECS/GEM)
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Edit recipes during runs
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Multiple user access levels
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Alarm history
Process
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Tunable selectivity
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Extensive process library
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Wide process latitude
For more information, contact us at information@plasmatherm.com or at +1.727.577.4999 |
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