The semiconductor and advanced manufacturing markets continue to evolve rapidly. As a result, Plasma-Therm remains...
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Upgrade Your Tegal RIE 900 Series with Cortex®—Performance That Moves You Forward
At Plasma-Therm®, we’re constantly pushing to help our customers get more out of their equipment....
Plasma-Therm & Family of Brands: Scalable Innovation from Lab to Fab
In a high-stakes, high-speed world of semiconductor innovation, your tools must be as agile as...
PlasmaPOD™ by Advanced Vacuum™ – Empowering Innovation in R&D and Workforce Development
In today’s competitive landscape, research labs and workforce training programs need cutting-edge tools that are...
The Evolution of Nanotechnology
What do microns, nanometers, and angstroms all have in common? They are common units of...
Annual Customer Survey Ranks Plasma-Therm No. 1 in Etch and Clean Equipment
Customers have once again singled out Plasma-Therm as one of the industry’s best semiconductor equipment...
Experience Drives Success in Photonic Processing
Today’s information age requires moving and manipulating vast amounts of data at the highest possible...
Product Spotlight: Tegal™ Diode RIE Systems
Plasma-Therm® now offers the Tegal™ Diode Reactive Ion Etching (RIE) systems. The Tegal Diode RIE...
Etching the Future with the Cornell NanoScale Facility: Interview with Ron Olson and Vince Genova
Plasma-Therm had the pleasure of interviewing Ron Olson, Director of Operations at the Cornell Nanoscale...
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Etching the Future with the Cornell NanoScale Facility: Interview with Ron Olson and Vince Genova
Plasma-Therm had the pleasure of interviewing Ron Olson, Director of Operations at the Cornell Nanoscale Facility (CNF), as well as Vince Genova, CNF research staff scientist focused on Etch & Atomic Layer Deposition (ALD). Before his current role, Olson was Manager of the SiC Technology Transfer Team for GE Global Research at SUNY Polytechnic Institute’s […]